Bambu PLA Tough+ Filament
Material Characteristics
- Engineered for impact resistance
- Cyclic flexural durability
- Extended service life
- Diameter: 1.75mm ±0.03mm tolerance
System Compatibility
- Compatible: All AMS series models
Impact Resistance Performance
Designed for real-world mechanical stress applications, PLA Tough+ delivers toughness comparable to ABS with up to 200% interlayer bonding strength versus standard PLA. Material withstands impacts, drops, and collisions, optimal for RC vehicles, model aircraft, and durable tooling applications.
Mechanical Performance Comparison
| Property | PLA Tough+ | PLA Basic | ABS |
|---|---|---|---|
| Toughness (XY Impact Strength) | 80.6 ± 9.5 kJ/m² | 26.6 ± 2.8 kJ/m² | 39.3 ± 3.6 kJ/m² |
| Layer Adhesion (Z Impact Strength) | 25.9 ± 3.3 kJ/m² | 13.8 ± 0.9 kJ/m² | 7.4 ± 1.2 kJ/m² |
| Strength (XY Bending Strength) | 65 MPa | 76 MPa | 62 MPa |
| Stiffness (XY Bending Modulus) | 2140 MPa | 2750 MPa | 1880 MPa |
| Heat Resistance (HDT, 0.45 MPa) | 61°C | 57°C | 87°C |
Cyclic Flexural Endurance
Engineered for repetitive bending cycles, PLA Tough+ exceeds standard PLA performance in applications where conventional formulations fail. Optimal for components requiring flexural capability without structural failure—springs, fastening clips, and connection elements.
Long-Term Durability
Enhanced durability characteristics enable PLA Tough+ to maintain mechanical performance over extended operational periods, multiplying the service life of standard PLA applications. Suitable for demanding tool-grade implementations requiring impact resistance and cyclic flexural loading.
RFID Integration
Processing parameters embedded in RFID tags enable automatic configuration via AMS (Automatic Material System). Load-and-execute workflow eliminates manual parameter setup.
Hardware Compatibility
Compatible Equipment:
- Material systems: AMS, AMS 2 Pro, AMS HT, AMS lite
- Build surfaces: Cool Plate SuperTack, Smooth PEI, Textured PEI plates
- Hotends: All nozzle sizes/materials
Incompatible Equipment:
- None specified
Processing Guidelines
Thermal Emissions: Elevated extrusion temperature generates slightly stronger non-pungent odor versus standard PLA during melting. If necessary, reduce extrusion temperature or ensure adequate ventilation.
Support Material Recommendation: Due to exceptional interlayer bonding strength, dedicated support filaments (Bambu Support for PLA or Bambu Support for PLA/PETG) recommended as interface material for simplified removal and cleaner surface finish.
Additional Products
- Bambu Reusable Spool (33% discount): $7.99 USD (regular $11.99) - Low temp ≤70°C
- Support for PLA/PETG (20% discount): $27.99 USD (regular $34.99) - Tool-free support removal, includes spool, Black (65103) / 0.5kg
Usage Note
Refill material requires compatible spool.
Shipping Information
- Free shipping: orders >$89 (excludes printers, AMS units, smoke purifiers)
- Free shipping remote areas: orders >$199 (Alaska, Hawaii, Puerto Rico, Guam, Northern Mariana Islands, American Samoa - same exclusions)
- Complete terms: Shipping Policy documentation
